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Automatic Intelligent Micro Dispenser
Introducing the Automated Intelligent Micro-dispenser – with 6 independent axes on dual gantries and algorithm intelligence, SD1 doubles dispensing productivity for 3D-SiP, MEMS, and miniature packages.
Features
• Dual Gantry System with 6 Independent Axes: Two separate XYZ gantries allow independent tasks, effectively doubling dispensing productivity.• Ultra-Fine Dispensing: Capable of the world’s smallest solder dots at 80 µm with gaps as small as 20 µm, surpassing stencil and solder bumping limitations.• Compact Footprint: Up to 48% smaller than previous models, saving valuable production space.• High Yield & Productivity: Up to 87% yield improvement and 2× higher throughput compared to earlier systems.• Zero Clogging Technology: World’s first clog-free dispensing solution for uninterrupted long production runs.• Versatile Materials: Supports dispensing with T6 solder paste as well as conductive and non-conductive materials.• Intelligent Compensation Algorithms: Built-in closed-loop linear encoder and smart algorithms deliver high accuracy at extreme speeds for mass production.• Dual-Task Capability: Two dispensing heads can handle different processes simultaneously, enhancing flexibility and throughput.