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Full-Range Solder Paste Micro-Dispenser
Unveiled an all new format of solder paste micro-dispensing solutions as ‘All-in-one system’ at one go. Complete solution designed to solve micro-soldering adaptability where stencil solder, jet or printing underperform.
Features
• Micro-dispenser specialized for solder paste use — for high precision deposition beyond what traditional stencil printing can achieve.• Supports both contact dispensing (placing) and non-contact jetting of solder paste.• Dual-head option: can use two dispensing heads, either in toggle mode or operating independently.• Designed to achieve quite small dot/line sizes — approximately 80 µm or greater, depending on material and setup.• H-type XY gantry motion with Z-axis motion; capable of handling precise 4-axis movements (especially when configured with two heads).• Compact footprint / optimized for operations where space or flexibility is needed.